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Map of India's approved fabs
This page maps India's approved semiconductor projects by function, separating wafer fabrication from assembly, test, and packaging. It uses only verified project facts, keeps India-wide totals labelled as such, and flags which projects are fabs and which are back-end plants so the national picture stays accurate.
Last checked 2026-08-11 · every figure below carries its source
How to read India's semiconductor map
India's semiconductor projects fall into two broad categories, and reading the map correctly means keeping them apart. The first is wafer fabrication, the front-end stage where silicon wafers are processed into circuits. This is the most capital-intensive and technically difficult step. The second is assembly, test, and packaging, often called ATMP or OSAT (outsourced assembly and test, the back end of chip making where finished wafers are cut and packaged), the back-end stage where fabricated wafers are cut, packaged, and tested into usable chips. Most of India's approved projects so far sit in the second category, while fabrication is represented by a small number of anchor projects. The whole effort runs under the India Semiconductor Mission, launched in 2021 with an outlay of about Rs 76,000 crore, offering fiscal support of up to 50 percent of eligible project cost for approved fabs. Across all stages, India has around a dozen sanctioned semiconductor projects, with a cumulative value on the order of Rs 1.64 lakh crore. That figure is an India-wide total spanning many projects and should not be pinned to a single site. Keeping fabrication and packaging separate, and keeping totals labelled as national, is the discipline that makes the map trustworthy rather than a blur of large numbers.
The fabrication anchor: Dholera
The headline fabrication project is the Tata Electronics and PSMC fab at Dholera in Gujarat, approved by the Union Cabinet on 29 February 2024. It is India's first commercial wafer fab under construction. PSMC, Powerchip Semiconductor Manufacturing Corporation of Taiwan, is the technology partner. The reported investment is about Rs 91,000 crore, roughly US$11 billion, with the Press Information Bureau citing Rs 91,526 crore. The plan describes a 300mm fab with capacity of up to 50,000 wafers per month, targeting mature and specialty nodes such as 28, 40, 55, 90, and 110 nanometres rather than leading-edge nodes. The roadmap is reported to begin at 55 and 90 nanometres and move toward 28 nanometres, and an ASML lithography partnership has been confirmed. First silicon is targeted around December 2026, with commercial production reported for the middle of 2028, and no chip has been produced yet. Because fabrication is the hardest stage to establish, Dholera carries outsized significance on the map. It is the one place where India is currently building the ability to make chips from wafers, which is why it is described as the first fab rather than one of several.
Packaging and test plants
Most other approved projects are back-end assembly, test, and packaging plants. Micron's plant at Sanand in Gujarat, approved under the India Semiconductor Mission in 2023, is a packaging and test facility rather than a wafer fab, and it should not be confused with the Dholera fab even though both are in Gujarat. Tata also has an assembly and test plant at Jagiroad in Assam, extending the back-end footprint beyond Gujarat. Other companies, including CG Power and Kaynes, have units elsewhere in the country. These plants matter because a functioning industry needs both front-end fabrication and back-end packaging, and packaging plants build workforce skills, supplier links, and customer relationships faster and at lower capital cost than fabs. On the map, they form a broader base layer, while fabrication sits at the narrow top. Reading the two layers together shows an industry in an early formation phase, with packaging capacity spreading across states and fabrication concentrated so far in a single anchor project. This structure is common for countries entering the industry, which typically build back-end capability before front-end fabrication reaches scale.
Recent additions and the honest picture
The map keeps changing as new projects are approved. Two further Gujarat semiconductor units were approved on 5 May 2026, one at Dholera and one at Surat, together worth over Rs 3,900 crore and expected to create over 2,200 jobs, though these figures are still settling. Additions like these expand the footprint but do not change the basic shape: a small number of fabrication anchors and a wider set of packaging and component projects. It is also worth remembering what did not happen. The Vedanta and Foxconn plan, announced as a memorandum of understanding in September 2022 at around US$19.5 billion, was never built, and Foxconn withdrew on 10 July 2023. It should not be counted as a committed facility. The honest picture of India's fab map is one of early, incentive-backed momentum with real construction underway at Dholera and genuine packaging capacity forming, set against the reality that no Indian fab has yet produced a commercial chip. Treating approved projects, projects under construction, and operating plants as different categories, and keeping India-wide totals labelled as national, keeps the map accurate.